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The North China Industrial Control EPC-3206HG is equipped with the Hygon 3000 series processor, meeting the product requirements for industrial gateways

The North China Industrial Control EPC-3206HG is equipped with the Hygon 3000 series processor, meeting the product requirements for industrial gateways

Time: 2026-05-06 Views: 8
Industrial gateways are key equipment for industrial IoT applications, primarily responsible for high-frequency data acquisition and local processing, cross-protocol communication conversion and coordinated control, as well as industrial-grade security protection. They are widely used in specialized scenarios such as smart manufacturing and energy management. To meet the deployment requirements of gateway products in various industrial settings, North China Industrial Control has introduced professional and customizable industrial computer solutions, such as the EPC-3206HG equipped with the Hygon 3000 series processor.
Konka releases industrial grade wide temperature Core Ultra3 series modules

Konka releases industrial grade wide temperature Core Ultra3 series modules

Time: 2026-04-30 Views: 27
Konkat, a leading supplier of embedded and edge computing technologies, recently announced that its computer module product line based on Intel Core Ultra series 3 processors has officially expanded to the industrial wide temperature class (-40 ℃ to+85 ℃). This series of modules can provide up to 180 TOPS of high-efficiency computing power, designed specifically for the harsh environments of AI intensive fields such as industrial automation, robotics, healthcare, and smart retail. It maintains stable and reliable performance output even under extreme working conditions.
TSMC's 14 times mask size CoWoS is expected to be put into operation in 2028, and AVP Plant 1 in the United States will be put into use before 2029

TSMC's 14 times mask size CoWoS is expected to be put into operation in 2028, and AVP Plant 1 in the United States will be put into use before 2029

Time: 2026-04-27 Views: 42
TSMC announced at the 2026 North American Technology Forum on the 22nd local time that the CoWoS 2.5D heterogeneous integration technology with 14 times mask size is expected to begin production in 2028, and a larger version will be launched in 2029.
Mouser Electronics is now selling the Telit Cinterion SL871K2 GNSS module, which supports single-frequency and multi-constellation GNSS positioning

Mouser Electronics is now selling the Telit Cinterion SL871K2 GNSS module, which supports single-frequency and multi-constellation GNSS positioning

Time: 2026-04-23 Views: 23
Mouser Electronics, a renowned industry-leading distributor of ultra-competitive semiconductors and electronic components, is now offering the Telit Cinterion SL871K2 GNSS module for sale.
Vishay launches new aerospace grade common mode choke for EMI filtering in GaN and SiC switch applications

Vishay launches new aerospace grade common mode choke for EMI filtering in GaN and SiC switch applications

Time: 2026-04-16 Views: 32
Recently, Vishay Intertechnology, Inc. (NYSE stock code: VSH) announced the launch of a new aerospace grade surface mount common mode choke, SGCM05339, suitable for electromagnetic interference (EMI) filtering and noise suppression in harsh aerospace applications.
EMC countermeasure product: TDK launches ultra small noise suppression filter for audio circuits, achieving high noise attenuation in the 5GHz frequency band

EMC countermeasure product: TDK launches ultra small noise suppression filter for audio circuits, achieving high noise attenuation in the 5GHz frequency band

Time: 2026-04-13 Views: 53
TDK Corporation (TSE: 6762) announced the launch of its latest MAF0603GHY series noise suppression filter. The size of this filter is only 0.6 mm x 0.3 mm x 0.3 mm (length x width x height), suitable for small consumer electronics products such as smartphones and wearable devices. The new products in this series are expected to start mass production in April 2026.
Break the overseas monopoly! Chengdu Huawei releases the world's first 128GSPS ADC chip

Break the overseas monopoly! Chengdu Huawei releases the world's first 128GSPS ADC chip

Time: 2026-04-09 Views: 57
According to media reports, Chengdu Huawei has released the world's first 10 bit 128GSPS single-chip ultra high speed ADC chip, filling a domestic gap in one fell swoop. The sound, temperature, and radar signals in the real world are like cars speeding at high speeds, while ADC chips are like capture cameras on the racetrack. Their core task is to convert continuously changing analog signals into clear photos that digital devices can process.
TSMC plans to run out of chips by 2028

TSMC plans to run out of chips by 2028

Time: 2026-04-07 Views: 41
Vishay launches automotive grade photovoltaic MOSFET drivers to enhance high-voltage system reliability and reduce costs

Vishay launches automotive grade photovoltaic MOSFET drivers to enhance high-voltage system reliability and reduce costs

Time: 2026-04-02 Views: 48
The open circuit voltage of the device is 20 V, the short-circuit current is 20 μ A, and the conduction time is 80 μ s. It is packaged in SMD-4 and the molding material CTI reaches 600. The creepage distance is 8 mm
Nexperia launches 1200 V SiC MOSFET with industry-leading top heat dissipation package X.PAK

Nexperia launches 1200 V SiC MOSFET with industry-leading top heat dissipation package X.PAK

Time: 2026-03-30 Views: 72
Nexperia has officially launched a series of industrial grade 1200 V silicon carbide (SiC) MOSFETs that are efficient, stable, and reliable in performance. This series of devices exhibits excellent temperature stability and utilizes innovative surface mount (SMD) top heat dissipation packaging technology X.PAK. X. The PAK package has a compact appearance, with a size of only 14 mm × 18.5 mm, cleverly integrating the convenient advantages of SMD technology in the packaging process and the efficient heat dissipation capability of through-hole technology, ensuring excellent heat dissipation effect.
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