In application environments such as electric vehicle charging and AI data center power supply, the demand for higher power density solutions continues to grow as space becomes increasingly limited. In order to meet this application demand, Infineon Technologies has launched EasyPACK, a power module and packaging solution for compact design, at the PCIM Europe 2026 exhibition ™ S. The packaging height of EasyPACK S is only 5.6 mm, occupying a board area of approximately 33 x 36 mm ². While ensuring reliable thermal performance and low electromagnetic interference, it significantly assists in system miniaturization. The first batch of modules to adopt this new packaging method integrates Infineon's 1200 V CoolSiC ™ Technologies such as MOSFET G2, IGBT4, and 1200 V IGBT7.
Infineon EasyPACK ™ S module and packaging solution support compact design, suitable for high power density applications
EasyPACK S has passed the latest industrial and automotive standard certifications. This module adopts Infineon's technology XT interconnect technology has higher reliability and longer service life. Copper coated ceramic substrate (DBC) ensures stable thermal performance of the device and achieves uniform heat dissipation effect. By using a new plastic packaging material and silicon gel, the module supports continuous operation in a high temperature environment with a working junction temperature up to 175 ° C. The PressFIT pin not only doubles the current carrying capacity of the device, but also further simplifies the PCB layout. Its mechanical structure design supports automated production processes by presetting gripping positions, positioning holes, and reducing pin spacing, thereby helping to shorten manufacturing time and reduce costs.
EasyPACK S was designed with full consideration of future application requirements, suitable for next-generation SiC and GaN devices, while meeting the stringent requirements for device lifespan and reliability in various applications. Its scalable platform architecture provides great design flexibility in semiconductor technology, chip configuration, topology, and power levels, enabling performance optimization and accelerating design import.
Supply situation
The first batch of EasyPACK S modules integrating CoolSiC MOSFETs G2 and IGBT4 technology will be available for supply starting in July. At the upcoming PCIM 2026 exhibition in Nuremberg, Germany, Infineon will showcase related products.
Infineon will participate in PCIM Europe 2026
The PCIM Europe exhibition for power electronics systems and components will be held in Nuremberg, Germany from June 9th to 11th, 2026. Infineon will showcase its low-carbon and digital products and solutions at booth 470 in Hall 7.
