The new silicon carbide module provides satisfactory thermal performance and efficiency, enabling solid-state transformers (SST) to release more power available for word element generation
Microchip Technology Inc. announced today the launch of a new 3.3 kV HV-D3 mSiC ® The power module aims to simplify and accelerate the use of solid-state transformers (SST) in AI ultra large scale data centers and other high-voltage power applications. This new module adopts the industry standard 62 mm package and integrates 3.3 kV silicon carbide (SiC) mSiC MOSFET and Schottky diode, enabling efficient power supply directly from the medium voltage grid to the server rack.
As the scale of AI data centers continues to expand, the ability to generate lexical elements is limited by power supply, while energy efficiency directly determines the return on investment. Traditional architectures rely on bulky low-frequency transformers, which not only increase system complexity and losses, but also limit flexibility. Solid state transformers are a fundamental innovation in the field of power transmission, which can reduce the number of energy conversion stages and improve system efficiency. The next generation of AI infrastructure is gradually shifting towards high-voltage DC rack power distribution, further highlighting the value of solid-state transformers. It can directly output regulated DC power from the medium voltage power grid, greatly simplifying the conversion link.
Microchip's HV-D3 mSiC module is designed specifically to meet the above requirements. It adopts Microchip's mSiC MOSFET technology and has excellent on resistance RDS (on) stability throughout the entire operating temperature range; The package supports an insulation level of 6 kV and uses materials with a Leakage Traceability Index (CTI) of 600. It has an expandable creepage distance to ensure safe and reliable high-voltage series connections. Silicon nitride (Si ∝ N ₄) substrate has excellent thermal conductivity and strong power cycling ability, helping designers reduce cooling requirements while achieving higher power density.
Clayton Pillion, Vice President of Microchip's High Power Solutions Business Unit, said, "As AI data centers continue to push the limits of power supply from the grid to GPUs, the importance of solid-state transformers is becoming increasingly prominent. Our 3.3 kV HV-D3 mSiC power module can reduce the number of series devices by about half compared to low-voltage silicon carbide solutions when connected to 13.8 kV or 34.5 kV power grids. This product fills the gap in the industrial market for 100-300 ampere power devices, providing an ideal transition solution between discrete SiC devices and large power modules. ”
The HV-D3 mSiC power module offers two configurations: half bridge and common source, with/without anti parallel Schottky diodes, covering 100-300 ampere application scenarios. Microchip mSiC MOSFET technology has balanced switching losses in both hard switch and soft switch topologies, making it highly suitable for solid-state transformer design and other high-frequency and high-voltage systems.
The HV-D3 mSiC power module has been optimized for solid-state transformers in AI data centers and is suitable for a wide range of application areas, including megawatt level charging infrastructure for heavy vehicles, auxiliary power sources for railways/heavy transportation, medium voltage motor drives, as well as industrial and defense power systems. These fields also benefit from its excellent insulation performance, more reliable heat resistance, and more efficient electrical energy conversion performance.
Microchip has over 20 years of experience in the development, design, manufacturing, and support of SiC devices and power solutions, dedicated to helping customers easily, quickly, and reliably adopt SiC technology. The company's mSiC products and solutions aim to reduce system costs, accelerate product launch, and mitigate risks. Microchip offers a wide and flexible portfolio of SiC diodes, MOSFETs, and gate drivers. For more information, please visit www.microchip.com/sic.
development tools
The 3.3 kV power module is equipped with application notes, design guidelines, device models, and simulation models to support rapid prototyping development. Microchip also provides global technical support, design services, and on-site application engineering support.
Supply and Pricing
The 3.3 kV mSiC power module is now open for bulk procurement. You can purchase directly from Microchip, or contact Microchip sales representatives or authorized global distributors.
resource
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