Microchip launches new BZPACK mSiC ® Power module designed for high demand applications in harsh environments
Time: 2026-03-23
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Microchip Technology Inc. launches BZPACK mSiC today ® The power module is designed to meet the stringent high humidity, high voltage, and high temperature reverse bias (HV-H3TRB) standards. The BZPACK module provides excellent reliability, simplifies production processes, and offers rich system integration solutions for the most demanding power conversion applications. This module supports multiple topology structures, including half bridge, full bridge, three-phase, and PIM/CIM configurations, providing designers with flexible space to optimize performance, cost, and system architecture.