-Stable operation from 40 ℃ to+85 ℃, aiming at the rigorous scenario of AI edge computing
Konkat, a leading supplier of embedded and edge computing technologies, recently announced that its computer module product line based on Intel Core Ultra series 3 processors has officially expanded to the industrial wide temperature class (-40 ℃ to+85 ℃). This series of modules can provide up to 180 TOPS of high-efficiency computing power, designed specifically for the harsh environments of AI intensive fields such as industrial automation, robotics, healthcare, and smart retail. It maintains stable and reliable performance output even under extreme working conditions.
Industry leading modules (COM) that meet stringent requirements
The wide temperature level modules launched this time are all provided in the form of application ready (aReady. COM), which can easily cope with harsh working conditions such as extreme temperature differences, outdoor exposure, high-frequency vibration, and continuous heavy loads. To further enhance the durability of our products in harsh environments, Kangjia Te provides customized services such as aReady.YOURS, supporting value-added options such as three proof coatings, special component selection, and aging testing to meet the stringent requirements of different industries for high reliability. In terms of core performance, this series of modules continues the high specification configuration of the conventional version: up to 16 CPU cores are integrated (providing 10 TOPS computing power), built-in NPU5 supports low-power AI inference up to 50 TOPS, and is equipped with up to 4 Xe3 graphics cores to enhance AI acceleration performance based on GPGPU architecture. Developers can build high-performance embedded and edge systems with high scalability based on this platform, enabling local AI processing, sensor fusion, automation control, and safety critical loads on site, achieving a balance between high performance and high energy efficiency.
This series of modules is particularly suitable for applications that require high reliability, robustness, and stability, including task computing systems for autonomous driving or heavy vehicles, as well as outdoor edge systems in fields such as smart cities, energy and renewable energy, roadside infrastructure, and rail transit.
With a comprehensive product portfolio covering multiple specifications and module models, both new designs and existing system upgrades can be achieved - from compact, energy-efficient platforms to high-performance solutions with high I/O bandwidth.
Detailed module model
For new designs that require the highest data transfer rate (supporting PCIe Gen 5 and USB4), the COM-HPC Mini specification conga HPC/mPTL module and the COM-HPC Client specification conga HPC/cPTL module provide excellent performance and I/O bandwidth. For all mission critical applications based on COM Express Type 10, the credit card sized conga-MC1000 module is an ideal upgrade choice. The conga-TC1000 COM Express Compact module is designed for traditional cost sensitive systems that require technological updates, while the conga-TC1000r rugged module equipped with locking LPCAMM2 memory is specifically designed for high durability applications.
The supported operating systems include Microsoft Windows 11、Windows 11 IoT Enterprise、ctrlX OS、Ubuntu Pro、KontronOS、Linux And Yocto. As an application ready aReady.COM module, licensed ctrlX OS, Ubuntu Pro, and KontronOS can be pre configured. Through the aReady.VT option, developers can leverage integrated conga zones virtualization technology (Hypervisor) to integrate multiple workloads such as real-time control, human-machine interaction (HMI), AI processing, and IoT gateways into a single module. For industrial Internet of Things (IIoT) connectivity, Konka Tec provides its aReady.IOT software building module conga conc solution, which can achieve data exchange, maintenance and management of modules/carriers/peripherals, and can provide cloud connectivity services upon request. To further simplify application development, Kangjia Te also provides rich ecosystem support, including evaluation and production grade carrier boards, heat dissipation solutions, comprehensive technical documentation, design import services, and high-speed signal integrity measurement. With the customized services of aReady.YOURS, OEM manufacturers can also leverage Konka's comprehensive customized design and software integration services to obtain an embedded computing platform that is almost a "turnkey solution" (Turkey solution), equipped with advanced heat dissipation solutions.
