The all-new X.PAK package combines excellent heat dissipation performance, compact size, and convenient packaging features, suitable for high-power application scenarios
Nexperia has officially launched a series of industrial grade 1200 V silicon carbide (SiC) MOSFETs that are efficient, stable, and reliable in performance. This series of devices exhibits excellent temperature stability and utilizes innovative surface mount (SMD) top heat dissipation packaging technology X.PAK. X. The PAK package has a compact appearance, with a size of only 14 mm × 18.5 mm, cleverly integrating the convenient advantages of SMD technology in the packaging process and the efficient heat dissipation capability of through-hole technology, ensuring excellent heat dissipation effect. This new product release precisely meets the growing demand for discrete SiC MOSFETs in many high-power (industrial) application fields. With the advantage of top heat dissipation technology, this series of devices can achieve excellent thermal performance. These devices perform excellently in industrial applications such as battery energy storage systems (BESS), photovoltaic inverters, motor drives, and uninterruptible power supplies (UPS). In addition, it can also demonstrate outstanding performance in the field of electric vehicle charging infrastructure, including charging piles.
X. The PAK package allows the heat sink to be directly connected to the lead frame, further enhancing the heat dissipation performance of Nexperia SiC MOSFET and achieving efficient heat dissipation from the top of the casing. This design effectively reduces the negative impact of heat dissipation through PCB. At the same time, Nexperia's X.PAK packaging enables surface mount components to have low inductance characteristics and supports automated circuit board packaging processes.
The new X.PAK packaged device features Nexperia SiC MOSFET's consistent excellent quality factor (FoM). Among them, RDS (on), as a key parameter, has a significant impact on conduction loss. However, many manufacturers often only focus on the nominal value of this parameter (at room temperature), ignoring the fact that as the operating temperature of the device increases, the nominal value may increase by more than 100%, resulting in significant conduction losses. In contrast, Nexperia SiC MOSFETs exhibit excellent temperature stability, with RDS (on) nominal values increasing by only 38% within the operating temperature range of 25 ℃ to 175 ℃.
Katrin Feurle, Senior Director and Head of SiC Discretes and Modules at Nexperia, stated, "Our launch of SiC MOSFETs in X.PAK packaging marks a significant breakthrough in heat management and power density for high-power applications. Based on the previously successfully launched TO-247 and SMD D2PAK-7 package discrete SiC MOSFET devices, we have developed this new top heat dissipation product solution. This fully demonstrates Nexperia's firm commitment to providing customers with advanced and flexible product combinations to meet their evolving design needs. ”
The first batch of product portfolio covers models with RDS (on) values of 30, 40, and 60 m Ω (NSF030120T2A0, NSF040120T2A1, NSF060120T2A0), and plans to launch a 17m Ω product in April 2025. After 2025, a series of X.PAK packaged SiC MOSFET products that meet automotive standards, as well as more RDson grade products such as 80 m Ω, will be launched.
For more information about Nexperia silicon carbide MOSFETs, please visit: www.nexperia.com/sic-mosfets
About Nexperia
Nexperia is headquartered in the Netherlands and is a global semiconductor company with a rich and long history of development in Europe. Currently, it has over 14000 employees in Europe, Asia, and the United States. As a leader in the development and production of basic semiconductor devices, Nexperia's devices are widely used in various application fields such as automotive, industrial, mobile, and consumer, providing support for the basic functions of almost all commercial electronic designs in the world.
Nexperia provides services to global customers with an annual product shipment volume exceeding 100 billion units. These products have become industry benchmarks in terms of efficiency (such as process, size, power, and performance) and have gained widespread recognition. Nexperia has a rich IP product portfolio and continuously expanding product range, and has obtained certifications for IATF 16949, ISO 9001, ISO 14001, and ISO 45001 standards, fully demonstrating the company's firm commitment to innovation, efficiency, sustainable development, and meeting the stringent requirements of the industry.
