Adopting Microchip's advanced mSiC technology, it possesses excellent performance of MB and MC series silicon carbide MOSFETs
Microchip Technology Inc. launches BZPACK mSiC today ® The power module is designed to meet the stringent high humidity, high voltage, and high temperature reverse bias (HV-H3TRB) standards. The BZPACK module provides excellent reliability, simplifies production processes, and offers rich system integration solutions for the most demanding power conversion applications. This module supports multiple topology structures, including half bridge, full bridge, three-phase, and PIM/CIM configurations, providing designers with flexible space to optimize performance, cost, and system architecture.
The BZPACK mSiC power module has been tested and meets the HV-H3TRB standard for over 1000 hours, providing reliable support for industrial and renewable energy application deployment. This module adopts a packaging shell with a leakage trace index (CTI) of up to 600V, which has stable on resistance Rds (on) over the entire temperature range. It can be equipped with aluminum oxide (Al ₂ O3) or aluminum nitride (AlN) substrates, providing excellent insulation performance, thermal management capability, and long-term durability.
Clayton Pillion, Vice President of Microchip's High Power Solutions Business Unit, stated that the launch of the BZPACK mSiC power module further demonstrates Microchip's commitment to providing high reliability and high-performance solutions for the most demanding power conversion environments. Relying on advanced mSiC technology, we can provide customers with a more convenient path to help them build efficient and sustainable systems in the industrial and sustainable development markets. ”
To simplify production and reduce system complexity, the BZPACK module adopts a compact baseless design, equipped with crimped solderless terminals, and optional pre coated thermal interface material (TIM). These flexible configuration options enable faster assembly speed, higher consistency in manufacturing quality, and more convenient multi source procurement through industry standard packaging sizes. In addition, the module adopts a pin compatible design, making it easier to use.
Microchip's MB and MC series mSiC MOSFETs are designed to provide high reliability solutions for industrial and automotive applications, with some products certified to AEC Q101 automotive standards. These devices support universal gate source voltage (VGS ≥ 15V), adopt industry standard packaging, and are easy to integrate. The verified HV-H3TRB capability helps reduce the risk of on-site failures caused by leakage or breakdown due to moisture, ensuring long-term reliability. In addition, the MC series integrates gate resistors to achieve better switching control, maintain low switching losses, and enhance the stability of multi chip module configurations. The existing products are available in TO-247-4 Notch packaging and bare chip (wafer) form.
Microchip has over 20 years of experience in the research, design, manufacturing, and support of silicon carbide devices and power solutions, dedicated to helping customers easily, quickly, and confidently adopt silicon carbide technology. The mSiC series products and solutions of the company aim to reduce system costs, accelerate product launch, and lower development risks. Microchip offers a wide range of flexible silicon carbide diode, MOSFET, and gate driver products. For more information, please visit the official website: www.microchip.com/sic.
Supply and Pricing
The BZPACK mSiC power module is now available for mass production and supply. Customers can purchase directly from Microchip or contact Microchip sales representatives.
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