Ultra compact module provides up to 39 TOPS AI computing power
Kongat, the world's leading supplier of embedded and edge computing technologies, launched a new COM Express compact computer module equipped with AMD Reynold embedded 8000 series processors. This module is based on the dedicated computing core of the all-new Ryzen processor, featuring up to 8 "Zen 4" cores and innovative XDNA ™ NPU and powerful Radeon RDNA 3 ™ A graphics processor can provide up to 39 TOPS of amazing computing power for AI inference.
This makes the new conga-TCR8 Type 6 module particularly prominent in large-scale, price sensitive applications that require a combination of advanced AI, graphics, and computing capabilities. OEM manufacturers in fields such as medical imaging, testing and measurement, AI supported POS/POI systems, and professional gaming can leverage these long-term available COM Express compact modules to accelerate innovation while ensuring investment security. With a wide and scalable TDP power consumption range (15~54 watts), this module is also very suitable for upgrading existing designs. By simply replacing the module, the product can be upgraded to the latest technological level, significantly improving the product lifecycle, return on investment, and sustainability.
Martin Danzer, Director of Product Management at Konka Tec, explained, "The new module based on AMD Ryzen Embedded 8000 not only extends our high-performance edge AI platform series for innovative applications, but also allows developers to easily enjoy system integration advantages through the aReady.COM version. This new processor platform combines powerful CPU, GPU, and NPU cores, making it very easy to integrate. Customers and users will benefit from configured virtualization software, pre installed operating systems, enhanced IoT software, and flexible expansion options, thereby gaining advantages in cost, efficiency, and reliability
Detailed Function Introduction
The new conga-TCR8 computer module offers four different AMD Ryzen embedded 8000 processor configurations, with 6 or 8 "Zen 4" cores, supports up to 128GB of DDR5-5600 memory, and supports ECC functionality, making it suitable for data intensive and data critical applications. Integrated AMD XDNA ™ NPU (16 TOPS) and AMD Radeon RDNA ™ 3 graphics processors can also be used as GPGPUs for AI tasks, equipped with up to 12 computing units, combined to provide up to 39 TOPS of computing power. In addition, it also supports up to 4 immersive graphics outputs with 8K resolution. For fast peripheral connectivity, the module also provides 6 PCIe Gen 4 interfaces (8 channels), equipped with PEG x8 Gen 4 interfaces, 3 DisplayPort interfaces, 1 eDP or LVDS interface, 4 USB 3.2 Gen 2 interfaces, and 4 USB 2.0 interfaces. The audio signal is transmitted through HAD, and the storage device can use 2 SATA 6 Gb/s interfaces or onboard NVMe SSD. Simultaneously supporting general-purpose interfaces such as SPI, UART, I2C, and GPIO.
The new COM Express compact module also offers aReady COM options with custom pre installed and validated operating systems such as ctrlX OS, Ubuntu, and/or RT Linux, and optional aReady VT system integration function and aReady IoT connectivity function. According to customer requirements, the module can also be pre installed with customer applications, achieving easy integration for plug and play.
In addition, Kangjia Te's high-performance systems and design services simplify the application development process. The service content includes comprehensive board level support package, evaluation carrier board, customized heat dissipation solution, rich documentation and training, as well as high-speed signal integrity measurement, etc.
