Provide excellent heat dissipation performance while maintaining a smaller size
Nexperia, a high-capacity production expert in the field of basic semiconductor devices, announced today that 22 new planar Schottky diode product combinations using CFP3-HP packaging are now available. This product portfolio includes 11 industrial products and 11 products that comply with the AEC-Q101 standard. This product release is aimed at supporting the development trend of manufacturers replacing SMx type packaging devices with smaller CFP packaging devices, especially in automotive applications. These diodes are suitable for DC-DC conversion, freewheeling, reverse polarity protection, and OR in applications such as burping.
To achieve maximum design flexibility, the device options in this product portfolio offer a reverse voltage VR (max) of 30 V to 100 V and a forward current IF (average) of 1 A to 3 A. A major feature of CFP3-HP is the use of exposed heat sinks, which can provide ultra-high levels of heat dissipation efficiency (Ptot) in this packaging size (3.7 mm x 1.8 mm x 0.9 mm).
Frank Matschullat, Product Line Manager for Nexperia Power Bipolar Discrete Devices, said, "As the industry packaging trend shifts towards smaller packaging such as CFP, Nexperia is committed to actively driving this trend and accelerating our commitment to packaging innovation. By investing heavily in expanding production capacity, we are well prepared to meet the increasing demand for CFP packaging products in the market and exceed market expectations for the next three years.". These diodes represent a new expansion of our extensive product portfolio of over 270 CFP packages
These packages utilize proprietary copper clip designs to meet challenging, efficient, and space saving design requirements. Nowadays, CFP packaging can be used for different power diode technologies, such as Nexperia's Schottky rectifier diodes and fast recovery rectifier diodes, but it can also be extended to bipolar transistors. This significantly enriches the diversity of products and further consolidates Nexperia's position as a leader in packaging innovation. We can provide customers with a wider range of device choices through semiconductor manufacturers with a reliable supply chain.
To learn more about Nexperia planar Schottky diodes packaged in CFP3-HP, please visit: www.Nexperia. com/cfp
