According to a report from Taicang High tech Zone, in July this year, Suzhou Gongjin Microelectronics Technology Co., Ltd. (hereinafter referred to as "Gongjin Microelectronics") successfully introduced its first packaging equipment. Its Class 100 dust-free room was put into operation in October, and the packaging production line was fully connected. The first packaging product will be launched in mid to late December.
It is understood that Gongjin Microelectronics, established at the beginning of last year, is the first mass production service provider in China that focuses on sensor packaging and testing business. The first phase plans to invest 980 million yuan to build a 18000 square meter research and development center and production base, which includes 100 level, 1000 level, and 10000 level cleanrooms. The production base will also build a packaging and testing production line for sensors and automotive electronic chips.
In July of this year, Gongjin Microelectronics successfully introduced the first Disco wafer cutting DFD6362 equipment, including wafer grinding equipment Disco DGP8761 and slotting equipment DFL7161; In August this year, Gongjin Microelectronics passed the IATF16949 automotive quality management system certification. IATF16949 Automotive Quality System Certification is an international quality management system standard
It is reported that Gongjin Microelectronics has a research and development design team of over 80 people, leading the world in technology in the field of sensor packaging and testing. The customer base includes sensor product design companies in the fields of consumer electronics, automotive electronics, industrial healthcare, etc. The company is based in the Yangtze River Delta and faces global customers, continuously cultivating and creating in the field of sensor and automotive electronic chip packaging and testing.
