Lanqi Technology announced that it is the first in the industry to pilot produce the DDR5 third-generation registered clock driver chip M88DR5RCD03. This chip is applied to the DDR5 RDIMM memory module, aiming to further improve the speed and stability of memory data access and meet the higher requirements of the new generation server platform for memory performance such as capacity, bandwidth, and access latency.
Lanqi Technology DDR5 Third Generation Registered Clock Driver
As a leading international supplier of memory interface chips, Lanqi Technology continues to improve its DDR5 memory interface technology and continuously promotes product upgrades and iterations. The company's newly launched DDR5 RCD03 chip supports a data rate of up to 6400 MT/s, an increase of 14.3% compared to the second generation and 33.3% compared to the first generation.
Compared with the RCD products of the DDR4 generation, this chip adopts a dual channel architecture, supporting higher storage efficiency and lower access latency; By using 1.1V VDD and 1.0V VDDIO voltages and various power saving modes, the power consumption is significantly reduced; Supports higher density DRAM, with a maximum capacity of 256GB for a single mode group.
Mr. Stephen Tai, President of Lanqi Technology, said, "We are honored to maintain industry leadership in the research and development and trial production of DDR5 RCD03 chips. Lanqi will continue to work closely with international mainstream CPU and DRAM manufacturers to assist in the large-scale commercialization of DDR5 servers
Dr. Dimitrios Ziakas, Vice President of Intel Memory and IO Technology, said, "Intel has always been at the forefront of DDR5 memory technology and ecosystem development, supporting reliable and scalable industry standards. We are pleased to see that Lanqi Technology has made new progress on the latest generation of DDR5 memory interface chips, which can compete with Intel's next-generation E-Core and P-core Xeon ® The CPU is used in conjunction to help unleash powerful performance
Mr. Yongcheol Bae, Executive Vice President of Samsung Electronic Memory Product Planning Team, said, "Samsung has been committed to the research and application of the latest generation of memory products to meet the rapidly growing demand for memory capacity and bandwidth in data-intensive applications. We look forward to maintaining stable cooperation with Lanqi, continuously improving DDR5 memory product standards, and promoting product iteration and innovation
In addition to RCD chips, Lanqi Technology also provides memory interfaces and module supporting chips such as DDR5 data buffer (DB), serial detection hub (SPD Hub), temperature sensor (TS), power management chip (PMIC), etc. These chips are also important components of the DDR5 memory module, and can be combined with RCD chips to provide multiple essential functions and characteristics for the DDR5 memory module.
Supply information
Lanqi Technology can now supply first, second, and third generation DDR5 registered clock driver chips with product models M88DR5RCD01, M88DR5RCD02, and M88DR5RCD03.
