Texas Instruments (TI) announced the launch of a global ultra small microcontroller (MCU). For compact applications such as medical wearable devices and personal electronic products, this achievement can be considered a significant breakthrough in both size and performance dimensions.
The size of the new MCU has been reduced by 38% compared to similar products in the industry, helping designers optimize board space while ensuring performance.
The new MCU further expands Texas Instruments' MSPM0 MCU product portfolio, not only enhancing the sensing and control capabilities of embedded systems, but also reducing costs, complexity, and design time.
Texas Instruments (NASDAQ code: TXN) recently launched a global ultra small MCU, further expanding its full range of Arm products ® Cortex ®- M0+MSPM0 MCU product portfolio. The MSPM0C1104 MCU adopts wafer chip level packaging (WCSP), with a size of only 1.38mm2, which is about the size of a black pepper grain, allowing designers to optimize the layout space of compact applications such as medical wearable devices and personal electronic products without affecting performance.
In ultra small systems such as earplugs and medical probes, board space is a scarce and valuable resource, "said Vinay Agarwal, Vice President and General Manager of MSP Microcontrollers at Texas Instruments. Thanks to this global ultra small MCU, our MSPM0 MCU product portfolio will bring infinite possibilities, making our daily life experience smarter and more interconnected
Texas Instruments' MSPM0 MCU product portfolio includes over 100 cost-effective MCUs that offer scalable on-chip analog peripheral configurations and multiple computing options, thereby enhancing the sensing and control capabilities of embedded designs. This series of devices was recently showcased at the International Embedded Exhibition held in Nuremberg, Germany.
Ultra small package, infinite possibilities
Consumers constantly demand that daily electronic devices such as electric toothbrushes and touch pens not only be smaller in size and lower in price, but also have more functions. To innovate in reducing product size, engineers increasingly need to use compact integrated components to increase functionality while maintaining board space. The MSPM0C1104 MCU fully utilizes the advantages of WCSP packaging technology. Through careful feature selection and Texas Instruments' cost optimization plan, its 8-solder ball WCSP size is only 1.38mm2, which is 38% smaller than similar products.
This MCU is equipped with 16KB of memory, 1 12 bit three channel analog-to-digital converter, and 6 general-purpose input/output pins; And it is compatible with standard communication interfaces such as Universal Asynchronous Receiver/Transmitter (UART), Serial Peripheral Interface (SPI), and Inter Integrated Circuit (I2C). This global ultra small MCU integrates precise high-speed analog components, allowing engineers to maintain the computing performance of embedded systems without increasing the board size.
To gain a deeper understanding of how this product optimizes packaging technology and functional integration, please read the technical article.
Using the same MCU product line to cover design requirements from small to large
Texas Instruments has included this new MSPM0C1104 in its MSPM0 MCU product portfolio, which combines scalability, cost optimization, and ease of use to shorten product time to market. Texas Instruments' MSPM0 MCU offers pin to pin compatible packaging options and feature sets to meet the memory, analog, and computing power needs of personal electronic products, industrial, and automotive applications. In addition, this product portfolio offers multiple small packaging options to help optimize board size and streamline material lists. With this optimization solution and functional integration, engineers can flexibly design products of various sizes while reducing system costs and complexity.
Texas Instruments' comprehensive ecosystem can provide further support, including software development kits optimized for all MSPM0 MCUs, hardware development kits for rapid prototyping, reference designs, and subsystems as common MCU functional code examples. With the Zero Code Studio tool from Texas Instruments, users can configure, develop, and run MCU applications in just a few minutes without writing any code. Engineers can utilize this ecosystem to extend design and reuse code without making significant modifications to hardware or software. In addition to this ecosystem, in order to meet future needs, Texas Instruments continues to increase investment to improve its internal manufacturing capabilities, which also provides support for the MSPM0 MCU product portfolio.
Packaging and supply situation
MSPM0C1104 MCU has started pre-sale on TI.com, welcome to purchase.
Supports multiple payment and shipping methods.
MSPM0C1104 LaunchPad ™ The development kit has been released on TI.com.
About Texas Instruments
Texas Instruments (TI) (NASDAQ: TXN) is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, enterprise systems, and communication equipment. We are committed to making electronic products more economical and practical through semiconductor technology, and making the world a better place. Nowadays, every generation of innovation builds on the foundation of the previous generation, making our technology more reliable, economical, and energy-efficient, thus achieving the widespread application of semiconductors in the field of electronic products. Log in to TI.com.cn to learn more details.
