Rich module product portfolio to assist in the deployment of high computing power and high-efficiency embedded AI applications
The leading supplier of embedded and edge computing building blocks, Germany's congatec, released the industry's most extensive computer module (COM) product portfolio based on Intel Core Ultra 3 series processors. These new high-performance modules can provide up to 180 TOPS of energy-efficient computing power, designed specifically for the next generation of AI acceleration. In most application scenarios, the high processing power of the module itself means that embedded AI applications will no longer require independent acceleration cards. The new COM module based on Intel Core Ultra 3 series processors is highly suitable for deployment in AI empowered markets, covering industrial automation and robotics, smart cities and transportation, healthcare, and retail POS systems.
Leading edge AI computer module in the industry
Kangjia Te has launched five new computer modules, covering four different specifications and sizes, fully utilizing the advanced heterogeneous core architecture of Intel Core Ultra 3 series processors, supporting both old and new systems to locally implement AI tasks such as natural language processing (NLP), large language model (LLM) operation, image classification, sensor fusion, and synchronous localization and mapping (SLAM).
All modules represent significant advances in edge AI computing. They provide up to 16 cores and AI computing power up to 10 TOPS; Integrate NPU5 for low-power AI inference up to 50 TOPS; And with up to 12 Xe3 core GPUs, AI performance can reach about 120 TOPS, replacing independent AI accelerators. For miniaturization designs that pursue size, weight, and power (SWaP) optimization, COM Express Mini and COM-HPC Mini modules are the best choices. The existing COM Express applications benefit from two different COM Express Compact modules, each optimized for durability or cost. For new applications that do not compromise on performance and I/O bandwidth, a brand new COM-HPC Client module can be used.
The growing demand for AI
Konrad Garhammer, Chief Technology Officer and Operations Officer of Konjate, said, "We are seeing a rapid growth in demand for higher computing and AI performance from edge applications, while many existing applications also need to be upgraded. By acquiring Kontron's module business, we are able to provide the market with the most comprehensive portfolio of module products based on Intel Core Ultra 3 series, covering small-sized specifications such as COM-HPC Mini and COM Express Type 10, as well as COM Express and COM-HPC Client designs focused on ultimate performance. ”
Michael Masci, Vice President of Edge Product Management at Intel, stated that the Intel Core Ultra 3 series processors mark a significant turning point in embedded system development. System designers can fully utilize integrated AI on embedded platforms without the need for independent AI accelerators. This brings a huge leap in computing power and AI performance to various embedded applications with long lifecycles and high reliability requirements, and is also very suitable for optimizing design in terms of size, weight, power consumption, and cost. ”
Martin Danzer, Director of Product Management at Kangjia Te, added, "Designers have long faced difficult trade-offs between performance and power consumption, size and cost. Kangjia Te is based on Intel ® Core ™ The rich module product portfolio of Ultra 3 series processors has completely changed this situation, allowing designers to achieve the required embedded AI performance in the required form factor specifications. ”
Module specification details
For new designs that require high data throughput for PCIe Gen 5 and USB4, the COM-HPC Mini module conga-HPC/mPTL and COM-HPC Client module conga-HPC/cPTL provide ultimate performance and I/O bandwidth. For critical task applications based on COM Express Type 10, the credit card sized conga-MC1000 is an ideal upgrade choice. For systems that are cost sensitive and urgently require technological updates, Kangjia Te has launched the conga-TC1000 COM Express Compact module; The reinforced conga-TC1000r, which uses screws to fix LPCAMM2 memory, is designed specifically for harsh industrial environments.
All computer modules are equipped with Intel Core Ultra 3 series processors based on the Intel 18A process, which can be expanded up to Intel Core Ultra X9 or X7 processors. They can be configured with up to 4 P cores, 8 E cores, and 4 low-power E cores. In terms of memory, it supports up to 96 GB of onboard LPDDR5X or slot style LPCAMM2 memory on specific SKUs, and supports optional in band ECC to meet critical task application requirements. The integrated Intel Xe display engine supports up to 3 independent 6K display outputs.
The supported operating systems include Microsoft Windows 11、Windows 11 IoT Enterprise、ctrlX OS、Ubuntu Pro、Kontron OS、Linux And Yocto. As an application ready aReady.COM module, ctrlX OS, Ubuntu Pro, and KontronOS can be pre installed and authorized. The aReady.VT option enables developers to integrate real-time control, HMI, AI, IoT gateway and other work tasks on a single module through the module integrated virtualization management program. In terms of Industrial Internet of Things (IIoT) connectivity, Kangjia Te provides aReady.IOT software building modules to achieve data exchange, maintenance, and management of modules, carriers, and peripherals, and can support cloud connectivity as needed. To further simplify application development, Kangjia Te also provides a comprehensive ecosystem, including evaluation and production grade carrier boards, customized heat dissipation solutions, comprehensive technical documentation, design import services, and high-speed signal integrity testing support.
