Laird Thermal Systems announces expansion of its micro thermoelectric cooler product line and launches OptoTEC ™ MBX Series, suitable for high-performance optoelectronic applications with limited space. The MBX series adopts next-generation thermoelectric materials and advanced automation processes, providing standard and customized options for TECs used in applications such as TO Can, TOSA, and Butterfly packaging. One of the innovative designs is the ability to achieve a more compact exterior size, with the smallest model measuring only 1.5 x 1.1mm and a thickness as thin as 0.65mm. Under specific space constraints, it can still ensure better cooling performance with as low power consumption as possible.
The MBX series has a high heat pump density of up to 43 W/cm2 and can achieve a temperature difference of up to 82 ℃ at an ambient temperature of 50 ℃. The MBX series ensures efficient thermal management and precise temperature control, protecting various optoelectronic devices operating in high-temperature environments, including laser diodes, optical transceivers, LiDAR, infrared (IR) sensors, and high-power indium phosphide (InP) VCSEL.
Andrew Dereka, Director of Thermal Power Products at Laird Thermal Systems, stated, "Driven by applications such as artificial intelligence and machine learning, the optical communication industry is rapidly advancing, requiring laser diodes in high-speed optical transceivers to have very high temperature stability. The MBX series is an ideal solution to ensure that optical devices maintain consistent wavelengths, reduce temperature drift, and extend their lifespan. Our significant investment in high-precision fully automated production lines reflects our commitment to process control, high volume capacity, and high reliability
The MBX series has passed rigorous Telcordia GR-468 CORE testing, ensuring excellent reliability and longer service life even in harsh environments, meeting higher qualification and reliability standards in the optoelectronic market. The MBX series can be customized according to customer requirements to meet specific requirements such as external dimensions, heat pump density, and refrigeration efficiency. The solder structure of this series can support reflow soldering temperatures up to 280 ℃ and wire soldering, making it suitable for a wide range of optoelectronic applications. The Laird thermal system also offers a variety of special surface treatment options, including gold-plated patterns, thermistor accessories, and sealing, to accommodate non sealed devices.
Regarding the Laird Thermal System
Laird Thermal Systems designs, develops, and manufactures thermal management solutions for demanding applications in the medical, industrial, and telecommunications markets. We are one of the manufacturers capable of producing the most diverse product portfolio in the industry, covering everything from thermoelectric refrigerators and components to temperature controllers and liquid refrigeration systems. With unparalleled expertise in thermal management, our engineers are able to use advanced heat dissipation modeling and management techniques to solve complex thermal management and temperature control problems. By providing professional design, sample production, and internal testing support, we are able to work closely with customers throughout the entire product development lifecycle, reduce various risks, and accelerate product launch speed. Our global design, manufacturing, and support resources can help customers shorten product design cycles, maximize production efficiency, uptime, product performance, and quality. Laird thermal systems are a better choice for standard or customized thermal management solutions.
